HHT High Quality Phone NAND CPU IC Glue Remove Blades for A13 A12 A11 A10 A9 A8 CPU
Packing: Handle * 3; Blades *6.
#1 blade: Mainly used for prying and removing glue for small chips.
#2 blade: Mainly used for prying and removing glue for large chips.
#3 blade: Mainly used for double-layer or single-layer chip disassembly.
#4 blade: This blade is specially designed for Android fonts to be easily damaged by prying force, and can also be used for disassembly of others chips.
#5 blade: Mainly used for chip hooking and scraping glue, suitable for samll gaps and scraping parts withouts falling off.
#6 blade: Mainly used to pry chips, such as hard drives and baseband processors and wifi chips.
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